EnSilica, a maker of mixed signal ASICs, has announced that it has established a new engineering hub in Cambridge, UK.

Rhopoint Components is now stocking the Cissoid CMT-PLA3SB12340A Silicon Carbide (SiC) MOSFET Intelligent Power Module.

TSMC has announced that it will be establishing its first European Design Centre (EUDC) in Munich later this year.

NXP Semiconductors announces the NTAG X DNA, a new Type 4 secure connected NFC tag, enabling secure authentication.

Research suggests that the rapid growth in XR content consumption is set to put a major strain on existing networks.

SCI Semiconductor raises £2.5m towards developing its security-enhanced MCU based on CHERI, a memory securing framework.

TI's technologies will help enable NVIDIA’s 800V DC power-distribution systems for next-generation AI data centres.

STMicroelectronics has released a set of antenna-matching companion chips for STM32WL33 wireless microcontrollers (MCUs) to ...

Asahi Kasei, a top PSPI (photosensitive polyimide) supplier to TSMC and Samsung, plans to cut PIMEL shipments.

At last year’s IEDM, imec reported a breakthrough in the hetero-integration of InP chiplets on a 300mm RF Si interposer, at ...

The European Union consortium PREVAIL, created to accelerate the development of next-generation edge-AI technologies, will ...

Eaton, the intelligent power management company, has announced the launch of the 9PX Gen2 5-11kW UPS - a new product that ...